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Full function bga rework station price RW-SP360C for smartphone motherboard repair
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Product Details
Condition | New | Brand Name | Shuttle Star | |
Model Number | RW-SP360C | Dimensions | L620*W580*H650 | |
Weight | 32kg | Usage | Welding, BGA Rework | |
Certification | CE/RoHS/ISO9001 | After-sales Service Provided | Overseas third-party support available |
Product Description
PCB Size | W50*D50~W400*D420 |
PCB Thickness | 0.5~3mm |
Working table adjustment | +/-50mm forward/backward,+200mm left/right |
Temperature Control | K-type thermocouple,close cycle controlled |
PCB locating way | outer |
Upper heater | hot air 800W |
Bottom heater | hot air 800W |
Bottom preheat | IR 2400W |
Power Supply | Single-phase 220V,50/60Hz,4KW |
Machine size | L620*W580*H650 |
Machine weight | 36.0kg |
2016 Best bga smd rework station price RW-SP360C for smartphone motherboard
Three temperature zone:
1) Top hot air heater 800W
2) Bottom hot air heater 800W
3) Bottom IR preheat - Prevent PCB board deforming ,2400W .
Features:
1) Made of high quality heating material; desoldering and soldering procedures of BGA are precisely controlled;
2) Movable heating head, which is able to move freely horizontally, easy to operated; - MOVEABLE TOP HEATER
3) Embedded industrial computer, PLC control, real-time profile display, able to display set profile and practically-tested profile; big size screen, easy to operate; - PLC CONTROL
4) Profile saving no limit in this industrial computer, can analyze the two practically-tested profiles, can input both English and Chinese; - ENGLISH ENABLE
5) The temperatures of the upper and lower hot air heaters can be precisely controlled according to their specific temperatures. The infrared constant temperature heating zone at the bottom area and the appropriate temperature- control settings make the rework safer and more reliable. - REAM-TIME DISPLAY
6) The supports for the BGA soldering supporting frame are micro-adjustable to restrain local sinkage.
7) Powerful cross flow fans cool the lower heating area rapidly; - COOL SYSTEM
8) The adjustable PCB positioning support, onto which the special fixtures for alloyed board could be installed, enables easy and fast positioning of the PCB board;
9) Buzz after soldering is finished or desoldering; Hand vacuum pen is adjustable for removing BGA; - HAND VACUUM
10) Both the upper and lower parts are equipped with over-temperature alarming and protection apparatus.-ALARMING
11) With different alloy hot gas nozzles, easy to replace. It could be tailored as per the specific requirements.-NOZZLE
12) The integrated design of machine and chassis is room-saving. could be altered to instrument-control.
13) The software can be updated to auto-profile in future by USB, no need to set profiles. - INTELLIGENT
wooden box package
Free shipping in mainland
1. Shuttle Star built in 2000, we are the first factory to do China-made BGA rework station in mainland,
and most of our staff have more than 5 years experience in Shuttle star company ;
2. Our factory past ISO
3. We have lots of patents.
4. We offer good quality and good technology to the world.our price is not cheap,but our service is very cheaper .
5. Our customer and approved certification
2016 Best bga smd rework station price RW-SP360C for smartphone motherboard
Contact Us
- Shenzhen Shuttle Star Industrial Co., Ltd.
- Contact nameLilly Lee Chat Now
- Phone86-755-27513884
- Address10F.Beifang Junyi Industrial Park,Xingwei Crossing,Fuyong district,Bao An,Shenzhen, Shenzhen, Guangdong
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